Ghostlop (prototype): Difference between revisions
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The location test version uses socketed EPROMs on the PROG board, flash chips on adapter boards for the C ROMs and EPROMs for M1 and S1 on the CHA. It has a piece of cardboard between the 2 boards to avoid shorts because the socketed flash adapter boards are a bit too high and could get shorted with traces on the PROG board. | |||
[[File:Ghostlop.jpg| | [[File:Ghostlop.jpg|800px]] | ||
Revision as of 10:19, 28 January 2019
| General Info | |
| USA Title | Ghostlop (prototype) |
| Japanese Title | Ghostlop (prototype) |
| European Title | Ghostlop (prototype) |
| NGH | 228 |
| Developer | Data East Corporation |
| Editor | SNK |
| Meg count | Unknown |
| TCRF page | None |
|
MVS Release | |
 
| |
| Release date | 1996 |
| PROG Board | PROGGSC |
| CHA Board | CHA256 |
| Protection Chip | none |
| MAME romset | ghostlop |
|
AES Release : No | |
|
CD Release : No | |
The location test version uses socketed EPROMs on the PROG board, flash chips on adapter boards for the C ROMs and EPROMs for M1 and S1 on the CHA. It has a piece of cardboard between the 2 boards to avoid shorts because the socketed flash adapter boards are a bit too high and could get shorted with traces on the PROG board.
